Tạp chí Công nghiệp nông thôn
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Số phát hành: Tạp chí công nghiệp nông thôn số 45/2022
Từ khóa:
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Tóm tắt
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Tài liệu tham khảo
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Egemen TEOMETE, “Effect of Process Parameters on Surface Quality for Wire Saw Cutting of Alumina Ceramic”, Gcizi University Journal of Science, Vol. 24, pp. 291- 297, 2011.
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Liqun Zhu, Imin Kao, “Galerkinbased modal analysis on the vibration of wire–slurry system in wafer slicing using a wire saw”, Journal of Sound and Vibration, Vol. 283, pp. 589–620, 2005.
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P.Q. Ge, L. Zhang, W. Gao and Z.C. Liu, “Development of Endless Diamond Wire Saw and Sawing Experiments”, Materials Science Forum, Vols 471-472, pp 481-484, 2004.
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Songbin Wei and Imin Kao, “Vibration analysis of wire and frequency response in the modern wires aw manufacturing process”, Journal of Sound and Vibration, Volume 231, pp. 1385-1395, 2000.
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Hao Wu Chris Yang Shreyes N. Melkote, “Effect of Reciprocating Wire Slurry Sawing on Surface Quality and Mechanical Strength of As-Cut Solar Silicon Wafers”, Precision Engineering, 2013.
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Pei-Lum Tso1, Bo-Huei Yan1, Chan Hsing Lo, “Study on Thin Diamond Wire Slicing with Taguchi method”, Materials Science Forum, Vols. 505-507, pp 1219-1224, 2006.
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Giang Thị Kim Liên. Quy hoạch thực nghiệm, Đại học Đà Nẳng, 2009.
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